Technology & Expertise           

Ultra-low power design

Miniaturization puts an additional challenge on electronic design in that the amount of power available is shrinking with product size.  Time-based designs and RTOS consuming a few nano-amps combined to smart power management allows to use minimal capacity batteries and reach new heights in product life span.


The mobile phone and microelectronics industry have been pushing suppliers to provide components in ever smaller packages.  When the context requires further integration, our experience with die handling and wafer processing opens the door to using advanced assembling processes such as wire bonding (ball/wedge), die stacking and flip-chip.

Energy harvesting

In products were the battery is an integral part of the package, energy harvesting is an option that is worth considering.  Would it be flexible amorphous silicon solar cells, piezo-mechanical , RF harvesting or Pelletier, we select the technology that can be tailored to almost any applications.

RF communications

New low power wireless communication protocols such as Bluetooth 4.0 have opened the door to exchange of information between devices with minimal use of power.  Wireless Personal Area Networks (WPANs) are called to play a key role as portable devices are interacting with each other more than ever before.  Passive and active RFID are also options that can be considered when implementing low-cost high-volume products such as smart sensors and tags. 

Polymer-based displays

Various flexible display technologies are now available for use in new product designs.  They revolutionize the way user interfaces are thought, in areas where display integration was not possible before.  Would it be bi-stable, LCD or FOLED, there is a display technology to match your application-specific requirements.

Flexible substrates & printed electronics

Building flexible electronic products requires a throughout expertise in the impact of stresses induced by mechanical movement in the product.  Working with the thinnest substrates available (FR4, polyimide and PET substrates down to a few microns) using ultra-small pitches makes it possible to integrate electronics in almost any form or shape, even when applications call for dynamic movement.  The advent of printed electronics also offers options for interconnection and basic electronic functionality where product cost is paramount.